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Yeh, L.-T. 1944-

Thermal management of microelectronic equipment : heat transfer theory, analysis methods, and design practices / L.T. Yeh, R.C. Chu - xxi, 414 pages : illustrations ; 24 cm - ASME Press book series on electronic packaging . - ASME Press book series on electronic packaging. .

Includes bibliographical references and index

1. Introduction -- 2. Conduction -- 3. Convection -- 4. Radiation -- 5. Pool boiling -- 6. Flow boiling -- 7. Condensation -- 8. Extended surfaces -- 9. Thermal interface resistance -- 10. Components and printed circuit boards -- 11. Direct air cooling and fans -- 12. Natural and mixed convection -- 13. Heat exchangers and cold plates -- 14. Advanced cooling technologies I: single-phase liquid cooling -- 15. Advanced cooling technologies II: two-phase flow cooling -- 16. Heat pipes -- 17. Thermoelectric coolers.

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.

ISBN: 0791801683

LCCN: 2001034086

Subjects--Topical Terms:
Electronic apparatus and appliances--Cooling
Electronic apparatus and appliances--Thermal properties
Heat--Transmission

LC Class. No.: TK7870.25 / .Y44 2002

Dewey Class. No.: