MARC ayrıntıları
| 000 -LEADER |
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| fixed length control field |
04198nam a2200229 i 4500 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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| fixed length control field |
981007s1991 enka b 001 0 eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
0412371308 |
| 035 ## - SYSTEM CONTROL NUMBER |
|---|
| System control number |
(OCoLC) |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
BAUN |
| Language of cataloging |
eng |
| Transcribing agency |
BAUN |
| Description conventions |
rda |
| 049 ## - LOCAL HOLDINGS (OCLC) |
|---|
| Holding library |
BAUN_MERKEZ |
| 050 04 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7836 |
| Item number |
.E39 1991 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Edwards, Phillip R. |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Manufacturing technology in the electronics industry : |
| Remainder of title |
an introduction / |
| Statement of responsibility, etc |
Phillip R. Edwards. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
London: |
| Name of producer, publisher, distributor, manufacturer |
Chapman & Hall, |
| Date of production, publication, distribution, manufacture, or copyright notice |
1991. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
247 pages: |
| Other physical details |
illustrations ; |
| Dimensions |
23 cm. |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc |
Includes bibliographical references and index. |
| 505 00 - FORMATTED CONTENTS NOTE |
|---|
| Title |
1 Introduction to the electronics industry |
| -- |
-- 1.1 A history of the electronics industry |
| -- |
-- 1.2 The electronics market |
| -- |
-- 1.3 Electronics manufacturing company structure |
| -- |
-- 1.4 Test engineering and quality assurance |
| -- |
-- 2 Electronic components |
| -- |
-- 2.1 Component interconnection methods |
| -- |
-- 2.2 Electronic components |
| -- |
-- 2.3 Component packaging |
| -- |
-- 2.4 Cabling |
| -- |
-- 2.5 Component quality assurance |
| -- |
-- 3 Electronic design |
| -- |
-- 3.1 Quality and reliability assessment |
| -- |
-- 3.2 The product design process |
| -- |
-- 3.3 Circuit design |
| -- |
-- 3.4 Integrated circuit design |
| -- |
-- 3.5 Circuit layout |
| -- |
-- 4 Semiconductor device manufacture |
| -- |
-- 4.1 Semiconductor materials |
| -- |
-- 4.2 Clean room requirements |
| -- |
-- 4.3 Silicon wafer manufacture |
| -- |
-- 4.4 Photolithography |
| -- |
-- 4.5 Layer fabrication processes |
| -- |
-- 4.6 Bipolar junction transistor fabrication |
| -- |
-- 4.7 Field effect transistor fabrication |
| -- |
-- 4.8 Integrated circuit packaging and testing |
| -- |
-- 5 Printed circuit board manufacture |
| -- |
-- 5.1 Printed circuit board types |
| -- |
-- 5.2 Printed circuit board substrate materials |
| -- |
-- 5.3 Printed circuit board substrate manufacture |
| -- |
-- 5.4 Printed circuit board fabrication procedures |
| -- |
-- 5.5 Single-sided printed circuit board manufacture |
| -- |
-- 5.6 Double-sided printed circuit board manufacture |
| -- |
-- 5.7 Multilayer printed circuit board manufacture |
| -- |
-- 6 Printed circuit board assembly |
| -- |
-- 6.1 Hand assembly |
| -- |
-- 6.2 Automatic component insertion |
| -- |
-- 6.3 Assembly-related faults |
| -- |
-- 6.4 Soldering techniques |
| -- |
-- 6.5 Solder joint inspection and common soldering faults |
| -- |
-- 6.6 Cleaning |
| -- |
-- 6.7 Testing and reworking |
| -- |
-- 7 Surface mount component assembly |
| -- |
-- 7.1 Advantages of surface mount components |
| -- |
-- 7.2 Surface mount component assembly |
| -- |
-- 7.3 Adhesive application |
| -- |
-- 7.4 Solder paste application |
| -- |
-- 7.5 Component onsertion |
| -- |
-- 7.6 Soldering techniques |
| -- |
-- 7.7 Mixing surface mount with leaded components |
| -- |
-- 7.8 Soldering quality |
| -- |
-- 7.9 Testing |
| -- |
-- 7.10 Reworking |
| -- |
-- 8 Alternative technologies |
| -- |
-- 8.1 Hybrid technology |
| -- |
-- 8.2 Tape automated bonding |
| -- |
-- 8.3 Silicon on silicon wafer-scale integration |
| -- |
-- 8.4 Application-specific integrated circuits |
| -- |
-- 8.5 Flexible circuits |
| -- |
-- References |
| -- |
-- Further reading. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc |
The sequence of events which led to the writing of this book started at a seminar on Manufacturing Technology in the Electronics Industry given by the Institution of Production Engineers in 1987. The seminar identified that the field of manufacturing engineering for the electronics industry was effectively missing from the vast majority of production engineering degree courses. The reason for this was that production engineering departments typically spring from mechanical engineering departments. This leads to a mechanical bias in the practical aspects of such courses. The consequence of this was that electronics companies could not recruit graduates with both relevant production engineering and electronic engineering backgrounds. This necessitated either recruiting production engineering graduates and giving them the necessary electronic engineering training, or giving production engineering training to electronic engineering graduates. A consequence of the lack of courses in a subject is that there is also a lack of relevant textbooks in the area, as most textbooks are intended to tie into courses. In the field of manufacturing technology for the electronics industry, existing textbooks tend to be highly specialized and mainly concerned with the fabrication of semiconductor devices. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Electronic apparatus and appliances. |
| 900 ## - EQUIVALENCE OR CROSS-REFERENCE-PERSONAL NAME [LOCAL, CANADA] |
|---|
| Personal Name |
1650 1969 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
Library of Congress Classification |
| Koha item type |
Kitap |
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