Modern electroplating / edited by Mordechay Schlesinger, Milan Paunovic.

"Sponsored by the Electrochemical Society, Inc."

"A Wiley-Interscience publication."

Includes bibliographical references and index.

Fundamental Considerations (M. Paunovic, and others) Electrodeposition of Copper (J. Dini) Electrodeposition of Nickel (G. Di Bari) Electrodeposition of Gold (P. Kohl) Electroless and Electrodeposition of Silver (M. Schlesinger) Tin and Tin Alloys for Lead-Free Solder (Y. Zhang and J. Abys) Electrodeposition of Chromium (N. Mandich and D. Snyder) Electrodeposition of Lead and Lead Alloys (M. Jordan) Electrodeposition of Tin-Lead Alloys (M. Jordan) Electrodeposition of Zinc and Zinc Alloys (R. Winand) Electrodeposition of Iron and Iron Alloys (M. Izaki) Electrodeposition of Palladium and Palladium Alloys (J. Abys and C. Dullaghan) Nickel Alloys, Cobalt, and Cobalt Alloys (G. Di Bari) Electrodeposition of Semiconductors, (T. Schlesinger) Deposition on Nonconductors (M. Schlesinger) Electrodeposition of Organic Films: Conductive Polymers (T. Osaka, and others) Electroless Deposition of Copper (M. Paunovic) Electroless Deposition of Nickel (M. Schlesinger) Electroless Deposition of Cobalt Alloy Films (T. Osaka, and others) Electroless Deposition of Palladium and Platinum (I. Ohno) Electroless Deposition of Gold (Y. Okinaka and M. Kato) Electroless Deposition of Alloys (I. Ohno) Preparation for Deposition (D. Snyder) Manufacturing Technologies (D. Turner) Monitoring and Control (D. Turner) Environmental Aspects of Electrodeposition (M. Tomkiewicz) Appendix.