TY  - BOOK
AU  - Schlesinger,Mordechay
AU  - Paunovic,Milan
TI  - Modern electroplating
T2  - Electrochemical Society series
SN  - 0471168246
AV  - TS670 .M554 2000
PY  - 2000///
CY  - New York
PB  - Wiley
KW  - Electroplating
N1  - "Sponsored by the Electrochemical Society, Inc."; "A Wiley-Interscience publication."; Includes bibliographical references and index; Fundamental Considerations; (M. Paunovic, and others); Electrodeposition of Copper (J. Dini); Electrodeposition of Nickel (G. Di Bari); Electrodeposition of Gold (P. Kohl); Electroless and Electrodeposition of Silver (M. Schlesinger); Tin and Tin Alloys for Lead-Free Solder (Y. Zhang and J. Abys); Electrodeposition of Chromium (N. Mandich and D. Snyder); Electrodeposition of Lead and Lead Alloys (M. Jordan); Electrodeposition of Tin-Lead Alloys (M. Jordan); Electrodeposition of Zinc and Zinc Alloys (R. Winand); Electrodeposition of Iron and Iron Alloys (M. Izaki); Electrodeposition of Palladium and Palladium Alloys (J. Abys and C. Dullaghan); Nickel Alloys, Cobalt, and Cobalt Alloys (G. Di Bari); Electrodeposition of Semiconductors, (T. Schlesinger); Deposition on Nonconductors (M. Schlesinger); Electrodeposition of Organic Films: Conductive Polymers (T. Osaka, and others); Electroless Deposition of Copper (M. Paunovic); Electroless Deposition of Nickel (M. Schlesinger); Electroless Deposition of Cobalt Alloy Films (T. Osaka, and others); Electroless Deposition of Palladium and Platinum (I. Ohno); Electroless Deposition of Gold (Y. Okinaka and M. Kato); Electroless Deposition of Alloys (I. Ohno); Preparation for Deposition (D. Snyder); Manufacturing Technologies (D. Turner); Monitoring and Control (D. Turner); Environmental Aspects of Electrodeposition (M. Tomkiewicz); Appendix
UR  - http://www.loc.gov/catdir/bios/wiley047/00042272.html
UR  - http://www.loc.gov/catdir/description/wiley031/00042272.html
UR  - http://www.loc.gov/catdir/toc/onix01/00042272.html
ER  -