TY  - BOOK
AU  - Yeh,L.-T.
TI  - Thermal management of microelectronic equipment: heat transfer theory, analysis methods, and design practices 
T2  - ASME Press book series on electronic packaging
SN  - 0791801683
AV  - TK7870.25 .Y44 2002
PY  - 2002///
CY  - New York
PB  - ASME Press
KW  - Electronic apparatus and appliances
KW  - Cooling
KW  - Thermal properties
KW  - Heat
KW  - Transmission
N1  - Includes bibliographical references and index; 1. Introduction; -- 2. Conduction; -- 3. Convection; -- 4. Radiation; -- 5. Pool boiling; -- 6. Flow boiling; -- 7. Condensation; -- 8. Extended surfaces; -- 9. Thermal interface resistance; -- 10. Components and printed circuit boards; -- 11. Direct air cooling and fans; -- 12. Natural and mixed convection; -- 13. Heat exchangers and cold plates; -- 14. Advanced cooling technologies I: single-phase liquid cooling; -- 15. Advanced cooling technologies II: two-phase flow cooling; -- 16. Heat pipes; -- 17. Thermoelectric coolers
N2  - With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies
ER  -