TY  - BOOK
AU  - Paunovic,Milan
AU  - Schlesinger,Mordechay
TI  - Fundamentals of electrochemical deposition
T2  - The Electrochemical Society series
SN  - 0471712213
AV  - TS670 .P29 2006
PY  - 2006///]
CY  - Hoboken, N.J.
PB  - Wiley-Interscience
KW  - Electroplating
N1  - Includes bibliographical references and index; 1	Overview	; 2	Water and ionic solutions	; 3	Metals and metal surfaces	; 4	Metal-solution interphase	; 5	Equilibrium electrode potential	; 6	Kinetics and mechanism of electrodeposition	; 7	Nucleation and growth models	; 8	Electroless deposition	; 9	Displacement deposition	; 10	Effect of additives	; 11	Electrodeposition of alloys	; 12	Metal deposit and current distribution	; 13	Characterization of metallic surfaces and thin films	; 14	In situ characterization of deposition	; 15	Mathematical modeling in electrochemistry	; 16	Structure and properties of deposits	; 17	Electrodeposited multilayers	; 18	Interdiffusion in thin films	; 19	Applications in semiconductor technology	; 20	Applications in the fields of magnetism and microelectronics	; 21	Frontiers in applications : the field of medicine
ER  -