| 000 | 02820nam a2200385 i 4500 | ||
|---|---|---|---|
| 001 | 19572 | ||
| 008 | 000526s2000 nyu b 001 0 eng | ||
| 010 | _a00042272 | ||
| 020 |
_a0471168246 _q(cloth : alkaline paper) |
||
| 035 | _a(OCoLC) | ||
| 040 |
_aDLC _beng _cDLC _dDLC _dBAUN _erda |
||
| 049 | _aBAUN_MERKEZ | ||
| 050 | 0 | 4 |
_aTS670 _b.M554 2000 |
| 082 | 0 | 0 | _221 |
| 245 | 0 | 0 |
_aModern electroplating / _cedited by Mordechay Schlesinger, Milan Paunovic. |
| 250 | _a4th ed. | ||
| 264 | 1 |
_aNew York : _bWiley, _c2000. |
|
| 300 |
_axiv, 868 pages : _billustrations ; _c26 cm. |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
||
| 338 |
_avolume _bnc _2rdacarrier |
||
| 490 | 1 | _aElectrochemical Society series | |
| 500 | _a"Sponsored by the Electrochemical Society, Inc." | ||
| 500 | _a"A Wiley-Interscience publication." | ||
| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | 0 |
_tFundamental Considerations _r(M. Paunovic, and others) _tElectrodeposition of Copper (J. Dini) _tElectrodeposition of Nickel (G. Di Bari) _tElectrodeposition of Gold (P. Kohl) _tElectroless and Electrodeposition of Silver (M. Schlesinger) _tTin and Tin Alloys for Lead-Free Solder (Y. Zhang and J. Abys) _tElectrodeposition of Chromium (N. Mandich and D. Snyder) _tElectrodeposition of Lead and Lead Alloys (M. Jordan) _tElectrodeposition of Tin-Lead Alloys (M. Jordan) _tElectrodeposition of Zinc and Zinc Alloys (R. Winand) _tElectrodeposition of Iron and Iron Alloys (M. Izaki) _tElectrodeposition of Palladium and Palladium Alloys (J. Abys and C. Dullaghan) _tNickel Alloys, Cobalt, and Cobalt Alloys (G. Di Bari) _tElectrodeposition of Semiconductors, (T. Schlesinger) _tDeposition on Nonconductors (M. Schlesinger) _tElectrodeposition of Organic Films: Conductive Polymers (T. Osaka, and others) _tElectroless Deposition of Copper (M. Paunovic) _tElectroless Deposition of Nickel (M. Schlesinger) _tElectroless Deposition of Cobalt Alloy Films (T. Osaka, and others) _tElectroless Deposition of Palladium and Platinum (I. Ohno) _tElectroless Deposition of Gold (Y. Okinaka and M. Kato) _tElectroless Deposition of Alloys (I. Ohno) _tPreparation for Deposition (D. Snyder) _tManufacturing Technologies (D. Turner) _tMonitoring and Control (D. Turner) _tEnvironmental Aspects of Electrodeposition (M. Tomkiewicz) _tAppendix. |
| 650 | 0 | _aElectroplating. | |
| 700 | 1 | _aSchlesinger, Mordechay. | |
| 700 | 1 | _aPaunovic, Milan. | |
| 830 | 0 |
_9107991 _aElectrochemical Society series |
|
| 856 | 4 | 2 |
_3Contributor biographical information _uhttp://www.loc.gov/catdir/bios/wiley047/00042272.html |
| 856 | 4 | 2 |
_3Publisher description _uhttp://www.loc.gov/catdir/description/wiley031/00042272.html |
| 856 | 4 |
_3Table of Contents _uhttp://www.loc.gov/catdir/toc/onix01/00042272.html |
|
| 942 |
_2lcc _cKT |
||
| 999 |
_c16694 _d16694 |
||