000			02067nam a2200325 i 4500
008			010530s2002 nyua b 001 0 eng
010			_a2001034086
020			_a0791801683
040			_aDLC _cDLC _dGZM _dCIN _dBAUN _beng _erda
049			_aBAUN_MERKEZ
050	0	4	_aTK7870.25 _b.Y44 2002
082	0	0	_221
100	1		_aYeh, L.-T. _q(Lian-Tuu), _d1944-
245	1	0	_aThermal management of microelectronic equipment : _bheat transfer theory, analysis methods, and design practices / _cL.T. Yeh, R.C. Chu
264		1	_aNew York : _bASME Press, _c2002.
300			_axxi, 414 pages : _billustrations ; _c24 cm
336			_atext _btxt _2rdacontent
337			_aunmediated _bn _2rdamedia
338			_avolume _bnc _2rdacarrier
490	1		_aASME Press book series on electronic packaging
504			_aIncludes bibliographical references and index
505	0	0	_t1. Introduction _t-- 2. Conduction _t-- 3. Convection _t-- 4. Radiation _t-- 5. Pool boiling _t-- 6. Flow boiling _t-- 7. Condensation _t-- 8. Extended surfaces _t-- 9. Thermal interface resistance _t-- 10. Components and printed circuit boards _t-- 11. Direct air cooling and fans _t-- 12. Natural and mixed convection _t-- 13. Heat exchangers and cold plates _t-- 14. Advanced cooling technologies I: single-phase liquid cooling _t-- 15. Advanced cooling technologies II: two-phase flow cooling _t-- 16. Heat pipes _t-- 17. Thermoelectric coolers.
520			_aWith an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
650		0	_aElectronic apparatus and appliances _xCooling
650		0	_aElectronic apparatus and appliances _xThermal properties
650		0	_aHeat _xTransmission
830		0	_9110399 _aASME Press book series on electronic packaging.
900			_a24254
942			_2lcc _cKT
999			_c18947 _d18947