| 000 | 01852nam a2200337 i 4500 | ||
|---|---|---|---|
| 008 | 051208s2006 njua b 001 0 eng | ||
| 010 | _a2005058421 | ||
| 020 | _a0471712213 | ||
| 020 | _a9780471712213 | ||
| 040 |
_aDLC _beng _cDLC _dBAKER _dUKM _dC#P _dBAUN _erda |
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| 049 | _aBAUN_MERKEZ | ||
| 050 | 0 | 4 |
_aTS670 _b.P29 2006 |
| 082 | 0 | 0 | _222 |
| 100 | 1 | _aPaunovic, Milan | |
| 245 | 1 | 0 |
_aFundamentals of electrochemical deposition / _cMilan Paunovic, Mordechay Schlesinger |
| 250 | _a2nd ed | ||
| 264 | 1 |
_aHoboken, N.J. : _bWiley-Interscience, _c[2006] |
|
| 264 | 4 | _c©2006 | |
| 300 |
_ax, 373 pages : _billustrations ; _c25 cm |
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| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
||
| 338 |
_avolume _bnc _2rdacarrier |
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| 490 | 1 | _aThe Electrochemical Society series | |
| 504 | _aIncludes bibliographical references and index | ||
| 505 | 0 | 0 |
_t1 Overview _t2 Water and ionic solutions _t3 Metals and metal surfaces _t4 Metal-solution interphase _t5 Equilibrium electrode potential _t6 Kinetics and mechanism of electrodeposition _t7 Nucleation and growth models _t8 Electroless deposition _t9 Displacement deposition _t10 Effect of additives _t11 Electrodeposition of alloys _t12 Metal deposit and current distribution _t13 Characterization of metallic surfaces and thin films _t14 In situ characterization of deposition _t15 Mathematical modeling in electrochemistry _t16 Structure and properties of deposits _t17 Electrodeposited multilayers _t18 Interdiffusion in thin films _t19 Applications in semiconductor technology _t20 Applications in the fields of magnetism and microelectronics _t21 Frontiers in applications : the field of medicine |
| 650 | 0 | _aElectroplating | |
| 700 | 1 | _aSchlesinger, Mordechay | |
| 830 | 0 |
_9107991 _aElectrochemical Society series |
|
| 900 | _a24566 | ||
| 942 |
_2lcc _cKT |
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| 999 |
_c19142 _d19142 |
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