| 000 | 04198nam a2200229 i 4500 | ||
|---|---|---|---|
| 008 | 981007s1991 enka b 001 0 eng d | ||
| 020 | _a0412371308 | ||
| 035 | _a(OCoLC) | ||
| 040 |
_aBAUN _beng _cBAUN _erda |
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| 049 | _aBAUN_MERKEZ | ||
| 050 | 0 | 4 |
_aTK7836 _b.E39 1991 |
| 100 | 1 | _aEdwards, Phillip R. | |
| 245 | 1 | 0 |
_aManufacturing technology in the electronics industry : _ban introduction / _cPhillip R. Edwards. |
| 264 | 1 |
_aLondon: _bChapman & Hall, _c1991. |
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| 300 |
_a247 pages: _billustrations ; _c23 cm. |
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| 504 | _aIncludes bibliographical references and index. | ||
| 505 | 0 | 0 |
_t1 Introduction to the electronics industry _t-- 1.1 A history of the electronics industry _t-- 1.2 The electronics market _t-- 1.3 Electronics manufacturing company structure _t-- 1.4 Test engineering and quality assurance _t-- 2 Electronic components _t-- 2.1 Component interconnection methods _t-- 2.2 Electronic components _t-- 2.3 Component packaging _t-- 2.4 Cabling _t-- 2.5 Component quality assurance _t-- 3 Electronic design _t-- 3.1 Quality and reliability assessment _t-- 3.2 The product design process _t-- 3.3 Circuit design _t-- 3.4 Integrated circuit design _t-- 3.5 Circuit layout _t-- 4 Semiconductor device manufacture _t-- 4.1 Semiconductor materials _t-- 4.2 Clean room requirements _t-- 4.3 Silicon wafer manufacture _t-- 4.4 Photolithography _t-- 4.5 Layer fabrication processes _t-- 4.6 Bipolar junction transistor fabrication _t-- 4.7 Field effect transistor fabrication _t-- 4.8 Integrated circuit packaging and testing _t-- 5 Printed circuit board manufacture _t-- 5.1 Printed circuit board types _t-- 5.2 Printed circuit board substrate materials _t-- 5.3 Printed circuit board substrate manufacture _t-- 5.4 Printed circuit board fabrication procedures _t-- 5.5 Single-sided printed circuit board manufacture _t-- 5.6 Double-sided printed circuit board manufacture _t-- 5.7 Multilayer printed circuit board manufacture _t-- 6 Printed circuit board assembly _t-- 6.1 Hand assembly _t-- 6.2 Automatic component insertion _t-- 6.3 Assembly-related faults _t-- 6.4 Soldering techniques _t-- 6.5 Solder joint inspection and common soldering faults _t-- 6.6 Cleaning _t-- 6.7 Testing and reworking _t-- 7 Surface mount component assembly _t-- 7.1 Advantages of surface mount components _t-- 7.2 Surface mount component assembly _t-- 7.3 Adhesive application _t-- 7.4 Solder paste application _t-- 7.5 Component onsertion _t-- 7.6 Soldering techniques _t-- 7.7 Mixing surface mount with leaded components _t-- 7.8 Soldering quality _t-- 7.9 Testing _t-- 7.10 Reworking _t-- 8 Alternative technologies _t-- 8.1 Hybrid technology _t-- 8.2 Tape automated bonding _t-- 8.3 Silicon on silicon wafer-scale integration _t-- 8.4 Application-specific integrated circuits _t-- 8.5 Flexible circuits _t-- References _t-- Further reading. |
| 520 | _aThe sequence of events which led to the writing of this book started at a seminar on Manufacturing Technology in the Electronics Industry given by the Institution of Production Engineers in 1987. The seminar identified that the field of manufacturing engineering for the electronics industry was effectively missing from the vast majority of production engineering degree courses. The reason for this was that production engineering departments typically spring from mechanical engineering departments. This leads to a mechanical bias in the practical aspects of such courses. The consequence of this was that electronics companies could not recruit graduates with both relevant production engineering and electronic engineering backgrounds. This necessitated either recruiting production engineering graduates and giving them the necessary electronic engineering training, or giving production engineering training to electronic engineering graduates. A consequence of the lack of courses in a subject is that there is also a lack of relevant textbooks in the area, as most textbooks are intended to tie into courses. In the field of manufacturing technology for the electronics industry, existing textbooks tend to be highly specialized and mainly concerned with the fabrication of semiconductor devices. | ||
| 650 | 0 | _aElectronic apparatus and appliances. | |
| 900 | _a1650 1969 | ||
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_2lcc _cKT |
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| 999 |
_c4363 _d4363 |
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