000 01081nam a2200337 i 4500
001 424
005 20260306101423.0
008 920929s1993 nyua 001 0 eng
010 _a92036407
020 _a0471584711
_q(acid-free paper)
040 _aDLC
_beng
_cDLC
_dDLC
_dBAUN
_erda
041 0 _aeng
049 _aBAUN_MERKEZ
050 0 4 _aTK7870.15
_b.R34 1993
082 0 0 _220
100 1 _aRahn, Armin.
_992400
_eaut
245 1 4 _aThe basics of soldering /
_cArmin Rahn.
264 1 _aNew York :
_bWiley,
_c[1993]
264 4 _c©1993
300 _axv, 369 pages :
_billustrations ;
_c25 cm.
336 _atext
_btxt
_2rdacontent
337 _aunmediated
_bn
_2rdamedia
338 _avolume
_bnc
_2rdacarrier
500 _a"A Wiley-Interscience publication."
500 _aIncludes index.
505 0 0 _tSoldering.
_tSurface Mount Technology.
_tSolder Defects.
_tCleaning.
_tStatistical Quality Control.
_tIndex.
650 0 _aElectronic packaging.
_969798
650 0 _aSolder and soldering.
_969797
650 0 _aSurface mount technology.
942 _2lcc
_cKT
999 _c4365
_d4365