| 000 | 01032nam a2200265 i 4500 | ||
|---|---|---|---|
| 008 | 880209s1988 nyua b 101 0 eng | ||
| 020 | _a0891167315 | ||
| 035 | _a(OCoLC) | ||
| 040 |
_aBAUN _beng _cBAUN _erda |
||
| 049 | _aBAUN_MERKEZ | ||
| 050 | 0 | 4 |
_aTK7870.25 _b.P37 1988 |
| 082 | 0 | 0 | _219 |
| 245 | 0 | 0 |
_aCooling technology for electronic equipment / _cedited by Win Aung. |
| 264 | 1 |
_aNew York : _bHemisphere Pub. Corporation, _c[1988] |
|
| 264 | 4 | _c©1988 | |
| 300 |
_axiv, 838 pages : _billustrations ; _c24 cm. |
||
| 500 | _aPapers from the International Symposium on Cooling Technology for Electronic Equipment held in Honolulu, Hawaii, Mar. 1987. | ||
| 504 | _aIncludes bibliographies and index. | ||
| 650 | 0 |
_aElectronic apparatus and appliances _xCooling _xCongresses. |
|
| 650 | 0 |
_aElectronic digital computers _xCooling _xCongresses. |
|
| 700 | 1 | _aAung, W. | |
| 711 | 2 |
_aInternational Symposium on Cooling Technology for Electronic Equipment _d(1987 : _cHonolulu, Hawaii) |
|
| 900 | _a3227 | ||
| 942 |
_2lcc _cKT |
||
| 999 |
_c4366 _d4366 |
||